Failure and Material Analysis in Microelectronics
Failure and material analysis plays an important role in the development and yield enhancement of semiconductor components, from wafer manufacturing to packaging to electronic components. This analysis is necessary to understand process and design problems, which improves manufacturing yields and product reliability to increase product competitiveness. This special collection includes papers on materials synthesis by package level fault isolation, die level fault isolation, novel approaches in failure and material analysis technologies, and microscopy analysis and material characterization for microelectronics, including power devices.
Topics covered include, but are not limited to:
- Package level fault isolation
- Die level fault isolation
- Novel approaches in failure and material analysis technologies
- Microscopy analysis and material characterization
- Power devices (Si, SiC, GaN)
Editor
Ming-Ching Huang, Materials Analysis Technology, Inc.
Dong Gui, Taiwan Semiconductor Manufacturing Company
Manuscript Details & Submission
Authors are encouraged to use the JVST article template available here. During submission, you will have an opportunity to indicate that your paper is a part of one of these collections by choosing the Special Topic Collection on “Failure and Material Analysis in Microelectronics.”