AIP Publishing LLC
AIP Publishing LLC
  • pubs.aip.org
  • AIP
  • AIP China
  • University Science Books
  • Resources
    • Researchers
    • Librarians
    • Publishing Partners
    • Topical Portfolios
    • Commercial Partners
  • Publications

    Find the Right Journal

    Explore the AIP Publishing collection by title, topic, impact, citations, and more.
    Browse Journals

    Latest Content

    Read about the newest discoveries and developments in the physical sciences.
    See What's New

    Publications

    • Journals
    • Books
    • Physics Today
    • AIP Conference Proceedings
    • Scilight
    • Find the Right Journal
    • Latest Content
  • About
    • About Us
    • News and Announcements
    • Careers
    • Events
    • Leadership
    • Contact
  • pubs.aip.org
  • AIP
  • AIP China
  • University Science Books
  • Journals
  • Upcoming Special Topics
  • Journal of Vacuum Science & Technology A
  • 55 Years of Metalorganic Chemical Vapor Deposition (MOCVD)

55 Years of Metalorganic Chemical Vapor Deposition (MOCVD)

Submission Deadline: September 29, 2023

Metal organic chemical vapor deposition (MOCVD) and related techniques are a mainstay of semiconductor synthesis, spanning arsenides, anitmonides, nitrides, and complex device stacks. More recently, MOCVD has been used to create novel materials including two-dimensional materials, oxides, and chalcogenides. This special collection includes but is not limited to papers on materials synthesis by MOCVD and related techniques, MOCVD-enabled devices such as LEDs or solar cells, heterogeneous integration that includes MOCVD-grown materials, and advances in MOCVD and related technologies.

Topics covered include, but are not limited to:

  • Novel materials synthesis
  • MOCVD-enabled device (e.g. LEDs, solar cells)
  • Heterogeneous integration
  • Advances in MOCVD and related technologies
  • III-V Semiconductors and Devices (Nitrides, Arsenides, Phosphides, Antimonides, Bismites etc.)
  • II-VI Materials and Devices (CdTe, ZnO, ZnSe, ZnS, MCT, etc.)
  • IV-IV Materials and Devices (SiC, SiGe, GeSn, etc.)
  • Semiconducting Oxides and Epitaxial Dielectrics (TCO, Ga2O3, SnO2, etc.)
  • 2D Materials and van der Waals Heterostructures
  • Low-dimensional Structures (Nanowires, -dots)

Guest Editors

Necmi Biyikli, University of Connecticut

Mona Ebrish, Vanderbilt University

Sriram Krishnamoorthy, University of California, Santa Barbara

Xiuling Li, University of Texas

Okhyun Nam, Technical University of Korea

Hongping Zhao, The Ohio State University

Editors

Stephanie Law, Pennsylvania State University

Joshua Zide, University of Delaware


Manuscript Details & Submission

Authors are encouraged to use the JVST article template. During submission, you will have an opportunity to indicate that your paper is a part of this collection by choosing the Special Topic or Conference Collection “55 Years of Metalorganic Chemical Vapor Deposition (MOCVD)”.
Submission Deadline: September 29, 2023
  • Featured
  • APL Computational Physics: Now Open for Submissions
  • APL Engineering Physics: Coming Soon
  • APL Electronic Devices: First Articles Now Online
  • International Journal of Fluid Engineering: Now Open for Submissions
  • MechanoEngineering: Coming Soon
  • Call for Applications
  • Upcoming Special Topics
  • Submit Your Article
  • Visit AIP Author Services
  • Sign Up for News

Keep Up With AIP Publishing

Sign up for the AIP newsletter to receive the latest news and information from AIP Publishing.
Sign Up

AIP PUBLISHING

1305 Walt Whitman Road,
Suite 110
Melville, NY 11747
(516) 576-2200

Resources

  • Researchers
  • Librarians
  • Publishing Partners
  • Commercial Partners

About

  • About Us
  • Careers 
  • Leadership

Support

  • Contact Us
  • Terms Of Use
  • Privacy Policy

© 2025 AIP Publishing LLC
  • 𝕏