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  • Emerging Leaders in Materials Science

Emerging Leaders in Materials Science

Submission Deadline: October 31, 2024

APL Materials is proud to present this Special Collection highlighting groundbreaking research from emerging leaders across the diverse topical landscape of material science. The contributors to this collection are breaking new ground across materials science, as young investigators making their mark on their field. The collection celebrates these influential leaders and will promote the articles as invaluable research contributions. The expertise and innovation represented in the collection spans the entire spectrum of novel materials, exploring their design, synthesis, characterization, and diverse applications. This Special Topic serves as a comprehensive exploration of the state-of-the-art advances in the field of materials science, offering a platform for new authors to showcase their groundbreaking works. From material synthesis and characterization to applications in energy, electronics, optics, magnetics, biomaterials, and beyond, each article contributes to our understanding of research across various disciplines and shapes the future of scientific research. We invite you to embark on this intellectual journey with us, exploring cutting-edge research and celebrating those emerging leaders of material science.

Topics covered include, but are not limited to:

  • Material Analysis
  • Energy Materials
  • Optical Materials
  • Magnetic Materials
  • Electronic Materials
  • Catalytic Materials
  • Biomaterials
  • Functional Materials

To be considered for publication in this collection, please describe in the cover letter how you are an “emerging leader” in the field.


Guest Editors

Bo Wang, Beijing Institute of Technology, Editor-in-Chief

Marina Leite, University of California, Davis, Associate Editor

Baishakhi Mazumder, University of Buffalo, Associate Editor

Emilie Ringe, University of Cambridge, Associate Editor

Jordi Sort, Universitat Autònoma de Barcelona, Associate Editor

Ying-Wei Yang, Jilin University, Associate Editor

Submission Deadline: October 31, 2024
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