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  • Design and Development of High Entropy Materials

Design and Development of High Entropy Materials

Submission Deadline: July 31, 2022Contribute to this Special Topic

High-entropy materials (HEMs), including high-entropy alloys (HEAs) and high-entropy ceramics (HECs), are multicomponent systems that occupy the uncharted regions of phase diagrams. They have become exciting and vibrant fields of research since the concept of HEAs was first proposed in 2004. Nowadays the development of new structural materials based on HEAs has continued to be a hot topic. There are also increasing interests to develop functional properties of HEAs. Furthermore, the concept of entropy stabilization has been demonstrated in a mixture of oxides, and some other HECs have shown the addition of more components could result in a blend of enhanced functional properties. It is truly an exciting time to research HEMs technologies that have great potentials in many areas, not only structural, but also magnetic, thermal barrier coatings, thermoelectrics, catalysts, batteries and coatings against wear and oxidation/corrosion. This special topic focuses on the design and development of HEMs. Topics can include but are not limited to the challenges and future directions for developing HEMs, such as HEAs/HECs magnets, HEAs/HECs thermoelectric, HEAs/HECs as coatings and structural materials.

Topics covered include, but are not limited to:

  • High Entropy Alloys
  • Alloy Design
  • Magnetic Properties
  • Catalytic Properties
  • Wear Properties
  • Materials Characterization
  • High Entropy Ceramics
  • Structural Properties
  • Thermoelectric Properties
  • Electrical Properties
  • Environmental Resistance
  • Simulation, Modelling, Artificial intelligence

  • Guest Editors

    An-Chou Yeh, National Tsing Hua University

    Veerle Keppens, The University of Tennessee, Knoxville

    Dustin Allen Gilbert, The University of Tennessee, Knoxville

    Stéphane Gorsse, University of Bordeaux

    Submission Deadline: July 31, 2022Contribute to this Special Topic
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