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  • Journal of Vacuum Science & Technology B
  • Supply Chain Resilience for Semiconductor Devices and Manufacturing

Supply Chain Resilience for Semiconductor Devices and Manufacturing

Submission Deadline: December 7, 2026Contribute to this Special Topic

Decorative ImageThis special topic collection highlights recent research, progress, and perspectives focused on supply chain and sustainability challenges in semiconductor device manufacturing.


Topics covered include, but are not limited to:

  • PFAS-free and low-emission gases, alternative refrigerants, heat-transfer fluids, and solvents
  • Resists free of PFAS or NMP
  • Supply chain–based evaluation of deposition precursors
  • Water consumption
  • Advanced filtration and abatement technologies
  • Characterization of emerging materials
  • AI-driven methods
  • Sensor technologies
  • Material requalification
  • Recycled metals
  • Electronic waste management

Guest Editors
Heeyeop Chae, Sungkyunkwan University (SKKU)

Eric Joseph, IBM T. J. Watson Research Center

Editor
R. Mohan Sankaran, University of Illinois Urbana-Champaign


Manuscript Details & Submission

Authors are encouraged to use the JVST article template. During submission, you will have an opportunity to indicate that your paper is a part of this collection by choosing the Special Topic or Conference Collection on “Supply Chain Resilience for Semiconductor Devices and Manufacturing.”

Submission Deadline: December 7, 2026Contribute to this Special Topic
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