CHIPS: Future of Semiconductor Processing and Devices
Semiconductor devices, packaged individually or arranged monolithically into chips, are at the heart of information processing, storage, and communication in modern society and are used everywhere in every electronic and optoelectronic device. This special collection will cover the future of semiconductor materials, devices, and processing, a topic that finds itself at the forefront of research and news with the passing of the United States CHIPS and Science Act of 2022 and the global rise of interest in quantum computing.
This special collection will include review and perspective articles and contributed papers on materials, processes, and devices relating to semiconductor chips.
Topics covered include, but are not limited to:
- New materials for semiconductor devices, including memory and processor chips
- All types of semiconductor devices and new concepts, especially new memory and transistor architectures
- Lithography, especially extreme UV (EUV) and e-beam lithography
- All etching processes, including atomic layer etching (ALE) and plasma etching
- All thin film deposition processes, including atomic layer deposition (ALD) and area-selective deposition (ASD)
- Semiconductor materials and device metrology, including optical methods, imaging, CD-SEM, etc.
Guest Editors
Eric A. Joseph, IBM
Catherine Labelle, Intel
Luciana Meli, IBM
Gottlieb S. Oehrlein, University of Maryland
Manuscript Details & Submission
Authors are encouraged to use the JVST article template. Submission information can be found here. During submission, you will have an opportunity to indicate that your paper is a part of this collection by choosing the Special Topic Collection: CHIPS: Future of Semiconductor Processing and Devices.