The demand for precision components is on the rise in a variety of engineering industries. Over the last 10 years, ultraprecision manufacturing technology has been applied on an industrial scale to ultraprecision production of products such as mobile phones, security monitor systems, head-up displays (HUD) and varifocal lenses, etc. However, it has always been a challenge for engineering science to support high-precision exploration and application, and the industrial scale-up has further increased those challenges.
As a result, it has never been so important to understand the fundamentals in engineering science and key enabling precision engineering technologies that drive ultraprecision manufacturing from small batch machining towards industrial scale production. A holistic precision engineering approach and the associated scientific understanding are desired and thus able to bridge these gaps in a seamless and sustainable manner.
This special issue provides a forum for researchers and practitioners in the field to review the knowledge and insights accumulated so far and consider opportunities and implications for the future. We are seeking original contributions discussing the development and application of the themes outlined above.
The exploration of surfaces, interfaces, nanostructures and thin films using:
- Multiscale multiphysics modelling and analysis for precision engineering
- Micro/nano engineering tribology
- Micro mechanics, micro cooling and heat transfer
- Micro and nano cutting mechanics
- Micro fluidics and micro manufacturing
- Non-traditional and hybrid micro/nano manufacturing
- Micro and nano manufacturing with lasers
- Vibration assisted methods for micro/nano machining
- Micro/nano metrology and practices
- Micro/nano surface texturing and characterisation
- In-process measurement and monitoring
- Ultraprecision manufacturing for medical devices and applications
- Ultraprecision manufacturing for sustainability development
- Research and industrial ultraprecision application studies
Kai Cheng, Brunel University London, UK. Email: firstname.lastname@example.org
Yanhua Zou, Utsunomiya University, Japan. Email: email@example.com
Mark J. Jackson, Kansas State University, USA. Email: firstname.lastname@example.org
Zewei Yuan, Shenyang University of Technology, China. Email: email@example.com
Kristofer Gamstedt, Uppsala University, Sweden. Email: Kristofer.Gamstedt@angstrom.uu.se