AIP Publishing LLC
AIP Publishing LLC
  • pubs.aip.org
  • AIP
  • AIP China
  • University Science Books
  • Resources
    • Researchers
    • Librarians
    • Publishing Partners
    • Topical Portfolios
    • Commercial Partners
  • Publications

    Find the Right Journal

    Explore the AIP Publishing collection by title, topic, impact, citations, and more.
    Browse Journals

    Latest Content

    Read about the newest discoveries and developments in the physical sciences.
    See What's New

    Publications

    • Journals
    • Books
    • Physics Today
    • AIP Conference Proceedings
    • Scilight
    • Find the Right Journal
    • Latest Content
  • About
    • About Us
    • News and Announcements
    • Careers
    • Events
    • Leadership
    • Contact
  • pubs.aip.org
  • AIP
  • AIP China
  • University Science Books
  • Journals
  • Upcoming Special Topics
  • The Journal of Chemical Physics
  • Low-Dimensional Materials for Quantum Information Science

Low-Dimensional Materials for Quantum Information Science

Submission Deadline: February 7, 2022

Recent years have seen the beginnings of maturation of quantum information schemes in both highly specialized laboratory research environments and in engineered technologies for commercial applications. As with classical information technology in the last century, future advances in quantum information will likely be guided by mastery over the composition and function of materials. In particular, the impact of reduced dimensionality in heterostructures, nanostructures, molecular compounds, and other systems brings materials into regimes dominated by atomic-scale features or quantum properties, enabling avenues of control that shape the relevance of diverse material systems to information science applications. Low-dimensional materials and their interfaces with other components have been used to demonstrate size-dependent properties, chemical, electronic, magnetic, or optical control, and quantum manipulation, among other relevant phenomena. These same opportunities in both existing and new low-dimensional materials will be crucial for driving the development of highly-engineered, scalable, and functional quantum information applications in communication, sensing and computation.

This special issue highlights the experimental and theoretical advances in the understanding of low-dimensional materials that are broadly relevant for emerging quantum information science. Lying at the intersection of physics, chemistry, materials science, engineering, and computation, this topic will encompass diverse material systems, phenomenology, experimental demonstrations, theoretical advances, and device implementations.

Topics covered include, but are not limited to:

  • diverse material systems
  • phenomenology
  • experimental demonstrations
  • theoretical advances
  • device implementations

Guest Editors

Prineha Narang, Harvard University, MA, USA

Nathaniel Stern, Northwestern University, IL, USA

Xiaodong Xu, University of Washington, WA, USA

JCP Editors

Lasse Jensen, Penn State University, PA, USA

David Reichman, Columbia University

Qiang Shi, Chinese Academy of Science, Beijing, China

Emily Weiss, Northwestern University, IL, USA


More information:

Please note that papers will be published as normal when they are ready in a regular issue of the journal and will populate on a virtual collection page within a few days of publication. Inclusion in the collection will not cause delay in publication.


How to submit:

  • Please submit through the online submission system.
  • Under manuscript type → select Article or Communication, as appropriate.
  • Under manuscript information → Title/Abstract → select “Invited Submission: No”.
  • Under manuscript information → Manuscript classification → select Special Topic: “Low-Dimensional Materials for Quantum Information Science”
Submission Deadline: February 7, 2022
  • Featured
  • APL Computational Physics: Now Open for Submissions
  • APL Engineering Physics: Coming Soon
  • APL Electronic Devices: First Articles Now Online
  • MechanoEngineering: Now Open for Submissions
  • Call for Applications
  • Upcoming Special Topics
  • Submit Your Article
  • Visit AIP Author Services
  • Sign Up for News
Decorative footer image

Keep Up With AIP Publishing

Sign up for the AIP newsletter to receive the latest news and information from AIP Publishing.
Sign Up
AIP Publishing and the Purpose Led Publishing logos

AIP PUBLISHING

1305 Walt Whitman Road,
Suite 110
Melville, NY 11747
(516) 576-2200

Resources

  • Researchers
  • Librarians
  • Publishing Partners
  • Commercial Partners

About

  • About Us
  • Careers 
  • Leadership

Support

  • Contact Us
  • Terms Of Use
  • Privacy Policy

© 2025 AIP Publishing LLC