Thermal Transport in Micro/Nanostructured Materials and Devices
Submission Deadline: October 31, 2025
As the world shifts towards cleaner solutions with higher efficiency, thermal transport and management are becoming increasingly more important to the success of next-generation information and energy technologies. This Special Topic will collect recent understanding and optimization of thermal transport in micro- and nanostructured materials and devices which are key to reducing energy loss, boosting performance, and significantly lowering our carbon footprint.Topics covered include, but are not limited to:
- Numerical simulation of multiscale heat transfer
- Microchannel heat exchanger
- Phase change at micro/nanoscale
- Heat transport at interface
- Thermal transport in functional materials
- Emerging technologies and fundamentals mechanisms in related topics
Guest Editors
Wei Wang, Peking University
Ronggui Yang, Peking University
Bai Song, Peking University
Chi Zhang, Peking University
Submission Deadline: October 31, 2025