Thermal Transport in Micro/Nanostructured Materials and Devices
Submission Deadline: September 30, 2025Contribute to this Special Topic

Topics covered include, but are not limited to:
- Numerical simulation of multiscale heat transfer
- Microchannel heat exchanger
- Phase change at micro/nanoscale
- Heat transport at interface
- Thermal transport in functional materials
- Emerging technologies and fundamentals mechanisms in related topics
Guest Editors
Wei Wang, Peking University
Ronggui Yang, Peking University
Bai Song, Peking University
Chi Zhang, Peking University
Submission Deadline: September 30, 2025Contribute to this Special Topic