AIP Publishing LLC
AIP Publishing LLC
  • pubs.aip.org
  • AIP
  • AIP China
  • University Science Books
  • Resources
    • Researchers
    • Librarians
    • Publishing Partners
    • Topical Portfolios
    • Commercial Partners
  • Publications

    Find the Right Journal

    Explore the AIP Publishing collection by title, topic, impact, citations, and more.
    Browse Journals

    Latest Content

    Read about the newest discoveries and developments in the physical sciences.
    See What's New

    Publications

    • Journals
    • Books
    • Physics Today
    • AIP Conference Proceedings
    • Scilight
    • Find the Right Journal
    • Latest Content
  • About
    • About Us
    • News and Announcements
    • Careers
    • Events
    • Leadership
    • Contact
  • pubs.aip.org
  • AIP
  • AIP China
  • University Science Books
  • Journals
  • Upcoming Special Topics
  • Journal of Applied Physics
  • Thermal Transport in 2D Materials

Thermal Transport in 2D Materials

Submission Deadline: June 30, 2024

There are many applications of 2D materials in nanodevices due to their excellent properties such as ultrahigh carrier mobility and thermal conductivity. Thermal management is critical for reliability and overall performance of the next generation of nanoelectronic power devices. The excellent thermoelectric properties exhibited by 2D materials suggest potential applications in energy conversion. Fundamental insights into the thermal transport behaviors of 2D materials are important for informing effective heat dissipation strategies of 2D material-based nanoelectronics, and are critical for evaluating other thermal-related factors such as thermoelectric coefficients. Further exploration of phonon transport in 2D materials can also provide theoretical guidance for thermal management design. This special issue aims to publish cutting-edge research on the fundamental physical properties, experimental techniques, theoretical simulations, and applications related to thermal transport in 2D materials.

This special issue will cover a wide range of topics related to thermal transport in 2D materials, including but not limited to:

  • Phonon Transport: Investigating the phonon dispersion, phonon coupling (magnon, electron), and phonon scattering that determine the thermal conductivity in 2D materials; phonon scattering in interface of the heterostructure
  • Anisotropy and Size Effects: Investigating the impact of anisotropy and size effects on the thermal transport of 2D materials.
  • Defects and Interfaces: Exploring the role of defects (point and topological defects, grain boundary, etc.) in tuning thermal transport.
  • Experimental Techniques: Presenting state-of-the-art experimental methods for characterizing thermal transport in 2D materials.
  • Theoretical Models: Investigating thermal transport in 2D materials by theoretical and computational methods. Efforts aimed at advancing predictive models and exploring innovative methodologies like high-throughput calculations and machine learning for accurate describing the thermal transport behaviors will be highly encouraged.
  • Applications: Highlighting the application potential of 2D materials in thermal-related applications such as thermal management devices, thermoelectric devices and thermal insulation.

Guest Editors

Minglei Sun, University of Antwerp

Kai Ren, Nanjing Forestry University


Submission and acceptance criteria:

Manuscripts considered for publication in Journal of Applied Physics are expected to meet the journal’s standard of acceptance: to report on original and timely results that significantly advance understanding in contemporary applied physics. Material that is exclusively review in nature is not considered for publication. Manuscripts submitted for consideration in this Special Topic must meet the same criteria and will undergo the journal’s standard peer-review process. The Editorial Team of Journal of Applied Physics will issue final decisions on the submitted manuscripts. Manuscripts will publish immediately upon acceptance.

For more information on the journal’s editorial policies, please click here.

Manuscripts must be submitted through the online submission system (PXP) of Journal of Applied Physics. Please select the Special Topic “Thermal Transport in 2D Materials” to submit your manuscript for consideration in this Special Topic.

Submission Deadline: June 30, 2024
  • Featured
  • APL Computational Physics: Now Open for Submissions
  • APL Engineering Physics: Coming Soon
  • APL Electronic Devices: First Articles Now Online
  • International Journal of Fluid Engineering: Now Open for Submissions
  • MechanoEngineering: Coming Soon
  • Call for Applications
  • Upcoming Special Topics
  • Submit Your Article
  • Visit AIP Author Services
  • Sign Up for News

Keep Up With AIP Publishing

Sign up for the AIP newsletter to receive the latest news and information from AIP Publishing.
Sign Up

AIP PUBLISHING

1305 Walt Whitman Road,
Suite 110
Melville, NY 11747
(516) 576-2200

Resources

  • Researchers
  • Librarians
  • Publishing Partners
  • Commercial Partners

About

  • About Us
  • Careers 
  • Leadership

Support

  • Contact Us
  • Terms Of Use
  • Privacy Policy

© 2025 AIP Publishing LLC