Interest in high-entropy materials continues its upward trajectory, with broad cross-discipline interest from physics, materials science, chemistry, and engineering. From compositionally complex to high-entropy alloys and ceramics, the breadth of customizability in structure-property relationships in these systems continues to diversify—leading to unexpected and exciting results in areas related to catalysis, ion transport, mechanical properties, phase stability, corrosion/oxidation resistance, hydrogen storage, magnetism, thermal transport, and radiation resistance. Highlighting the latest developments in this exciting new class of materials, this joint Applied Physics Letters/ Journal of Applied Physics special topic is timely as it will provide a current snapshot on the various ongoing efforts related to understanding the effects of high compositional complexity in conventional structure-process-property-performance relationships. The collection further aims to provide perspectives in emerging areas of research including materials design, characterization, and functional properties of high-entropy alloys, ceramics, thin films, and single crystalline materials.
Topics covered include, but are not limited to:
- Structure-process-property-performance relationships in compositionally complex materials including, but not limited to metals, carbides, nitrides, diborides, oxides, silicides, silicates
- Nature of defects
- Potential applications
- Electronic, magnetic, mechanical, catalytic, thermal property observations
- Phase stability and thermodynamics
- Theory, modeling, simulations
- Advanced characterization
Authors are welcome to submit letter manuscripts limited to 3000 words to Applied Physics Letters and longer, regular articles to Journal of Applied Physics. Manuscripts submitted to either journal should report on original and timely results that significantly advance understanding in applied physics. For more information on each journal’s editorial policies, please see here: Applied Physics Letters Editorial Policies and Journal of Applied Physics Editorial Policies. Perspective papers are welcome at either journal. Methods, Tutorials, and Reviews are welcome at Journal of Applied Physics.”
Please note that papers will be published as normal when they are ready in a regular issue of the journal and will populate on a virtual collection page within a few days of publication. Inclusion in the collection will not cause delay in publication.
How to Submit:
- Please submit through the online submission system.
- Under manuscript information → Manuscript classification → select Special Topic: “Era of Entropy”
Christina M. Rost, Virginia Polytechnic Institute and State University, Blacksburg, VA, USA
Abhishek Sarkar, Karlsruhe Institute of Technology (KIT), Germany
Scott McCormack, University of California Davis, Davis, CA, USA
T. Zac Ward, Oak Ridge National Laboratory, Oak Ridge, TN, USA
Alessandro Mazza, Los Alamos National Laboratory, Los Alamos, NM, USA
Easo George, University of Tennessee, Knoxville, TN, USA
Katharine Page, University of Tennessee, Knoxville, TN, USA
Submission and acceptance criteria:
Manuscripts considered for publication in Journal of Applied Physics are expected to meet the journal’s standard of acceptance: to report on original and timely results that significantly advance understanding in contemporary applied physics. Material that is exclusively review in nature is not considered for publication. Manuscripts submitted for consideration in this Special Topic must meet the same criteria and will undergo the journal’s standard peer-review process. The Editorial Team of Journal of Applied Physics will issue final decisions on the submitted manuscripts. Manuscripts will publish immediately upon acceptance.
For more information on the journal’s editorial policies, please click here.
Manuscripts must be submitted through the online submission system (PXP) of Journal of Applied Physics. Please select the Special Topic “Era of Entropy” to submit your manuscript for consideration in this Special Topic.