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  • Advances in Multi-Scale Mechanical Characterization

Advances in Multi-Scale Mechanical Characterization

Submission Deadline: April 15, 2022

The nanoscale mechanical properties of low-dimensional, innovative engineering and electronic materials, smart materials, biomaterials, hierarchically architectured systems, and miniaturized devices are quite interesting due to their extraordinary and scale-dependent behavior. As evident from the significant increase in the number of publications every year over the last two decades, the research community showed tremendous interest in advancing the small-scale mechanical testing instrumentation and employed them for probing the local mechanical and functional properties of advanced materials and devices. It is imperative because the reliability and performance of the advanced and intricate devices in various fields requires in-depth knowledge about their properties and their sensitivity to different service conditions; these are possible only by applying the advanced in-situ experimental techniques and/or simulation methods at small length scales. These understandings, obtained through experiments, computations, theory, and simulations with empirical-based atomistic methods, have led to the fabrication of new structures with tunable properties, thus achieving the aimed applications. Since this field is rapidly developing, an update on the new innovations advancing instrumentation, new theoretical models, and methods for improving the current understanding, and applications would be helpful for the researchers working in these areas. This Special Topic welcomes such high-quality contributions that provide deep insights into the mechanisms responsible for the scale-dependent mechanical behavior of advanced materials and their applications in solving complex challenges.

Topics covered include, but are not limited to:

  • Multi-scale mechanical testing and characterization of materials (Experiment, theory, modeling and simulation, applications)
  • Fabrication and mechanical manipulation of micro- or nanoscale objects and devices
  • Mechanical testing and measurement of materials’ hardness, elasticity, fracture toughness, and wear
  • In-situ observing of the mechanical deformation behavior and structure-property correlation studie
  • Materials testing in harsh environments and high-pressure research on materials
  • Emerging advanced materials for mechanical applications
  • Mechanical investigations of a wide range of materials: ceramics and alloys to cells, tissues, and hydrogels
  • Interplay between mechanical and functional properties

Guest Editors

Dr. Kiran Mangalampalli, SRM Institute of Science and Technology, India

Prof. Pijush Ghosh, Indian Institute of Technology Madras, India

Dr. Fabien Volpi, SIMaP – Université Grenoble Alpes, Grenoble, France

Assoc. Prof. Dr. Daniel Kiener, Montanuniversität Leoben, Austria

Dr. Alexey Useinov, Technological Institute for Superhard and Novel Carbon Materials, Russia

JAP Editors

Deputy Editor Christian Brosseau, Université de Bretagne Occidentale, France


Submission and acceptance criteria:

Manuscripts considered for publication in Journal of Applied Physics are expected to meet the journal’s standard of acceptance: to report on original and timely results that significantly advance understanding in contemporary applied physics. Material that is exclusively review in nature is not considered for publication. Manuscripts submitted for consideration in this Special Topic must meet the same criteria and will undergo the journal’s standard peer-review process. The Editorial Team of Journal of Applied Physics will issue final decisions on the submitted manuscripts. Manuscripts will publish immediately upon acceptance.

For more information on the journal’s editorial policies, please click here.

Manuscripts must be submitted through Journal of Applied Physics’ online submission system (PXP). Please select the Special Topic “Advances in Multi-Scale Mechanical Characterization” to submit your manuscript for consideration in this Special Topic.

Submission Deadline: April 15, 2022
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