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  • (Ultra)Wide-bandgap Semiconductors for Extreme Environment Electronics

(Ultra)Wide-bandgap Semiconductors for Extreme Environment Electronics

Submission Deadline: November 30, 2023

Wide-bandgap semiconductors (e.g., SiC and GaN) promise high tolerance to extreme environments, such as: ionizing radiation, energetic particles, high and low temperatures. Ultrawide-bandgap semiconductors, e.g., Ga2O3, B-Al-Ga-N, and diamond, are being investigated for even better extreme environment properties. Electronic devices capable of operating in extreme environments, with reduced need for environment control or shielding, are desirable for a wide range of applications, such as: cryogenic electronics, engine control, down hole drilling, and space systems.

Topics covered include, but are not limited to:

  • Physics (e.g., electron and phonon transport) of (ultra)wide-bandgap semiconductors subject to radiation and extreme temperatures
  • (Ultra)wide-bandgap semiconductor materials under extreme environments
  • (Ultra)wide-bandgap semiconductor defect properties under extreme environment
  • (Ultra)wide-bandgap semiconductor-based structures for extreme environments, such as: contacts, junctions, gate dielectrics, passivation dielectrics, and interconnects
  • (Ultra)wide-bandgap electronic devices, including diodes, field-effect transistors, and bipolar junction transistors, for extreme environment operation
  • Advanced characterization techniques for extreme environment semiconductor materials and devices

Guest Editors

Rongming Chu, Pennsylvania State University

Kevin Chen, Hong Kong University of Science and Technology

Carl-Mikael Zetterling, KTH Royal Institute of Technology

Ronald Schrimpf, Vanderbilt University

APL Editors

Hongping Zhao, The Ohio State University

Submission Deadline: November 30, 2023
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