Thermal Transport in Micro/Nanostructured Materials and Devices

Submission Deadline: September 30, 2025Contribute to this Special Topic
As the world shifts towards cleaner solutions with higher efficiency, thermal transport and management are becoming increasingly more important to the success of next-generation information and energy technologies. This Special Topic will collect recent understanding and optimization of thermal transport in micro- and nanostructured materials and devices which are key to reducing energy loss, boosting performance, and significantly lowering our carbon footprint.

Topics covered include, but are not limited to:

  • Numerical simulation of multiscale heat transfer
  • Microchannel heat exchanger
  • Phase change at micro/nanoscale
  • Heat transport at interface
  • Thermal transport in functional materials
  • Emerging technologies and fundamentals mechanisms in related topics

Guest Editors

Wei Wang, Peking University

Ronggui Yang, Peking University

Bai Song, Peking University

Chi Zhang, Peking University

Submission Deadline: September 30, 2025Contribute to this Special Topic