Diamond for Future Chips and Beyond

Diamond possesses ultrahigh thermal conductivity alongside exceptional electronic properties, making it uniquely positioned to overcome the severe thermal management bottlenecks in next-generation electronics. This Special Topic highlights recent advances spanning fundamental thermal transport mechanisms in diamond to its practical integration within modern semiconductor platforms. We welcome contributions exploring diamond synthesis and doping, heterointegration strategies, interfacial thermal resistance, and advanced chip-level cooling architectures. By bridging materials science with device engineering, this collection charts a roadmap toward utilizing diamond to enable energy-efficient, high-performance information technologies.

Topics covered include, but are not limited to:

Guest Editors

Chi Zhang, Peking University

Lin Yang, Peking University

Zhe Cheng, Peking University

Yuxi Wang, Peking University